New power semiconductors for high density applications require gate driver technologies that support higher working voltages and are reliable across an extended temperature range. The package must also meet international standards for creepage and clearance. This paper presents an innovative communication and isolation technology, integrated in a new industrial package
The efficiency and size benefits of SiC devices have been enthusiastically embraced by designers of industrial, automotive, traction systems and photovoltaic power conversion. To provide more detail, the lower sheet resistance of wide-bandgap SiC materials (typically 1/100th that of conventional silicon) results in smaller devices for a given current capacity—valuable
Power Integrations SCALE-iDriver™ IGBT及功率MOSFET门极驱动器的推出，让高可靠性中低压电子电力系统的设计变得更为轻松容易。新驱动器集成了Power Integrations独有的FluxLink™技术 —— 一种固体绝缘磁感耦合通信技术。FluxLink接口和eSOP封装可提供符合VDE0884-11及IEC60747-17标准的加强电气绝缘，并且具有非常强电磁干扰(EMI)及磁场抗扰性，可使生产厂商轻松达到IEC61000-4-8及IEC61000-4-9标准。
