Application Notes

Title	Description
AN-98 - LinkSwitch-TNZ Family Buck and Buck-Boost Design Guide	Description This application note provides information for designing a non-isolated power supply using the LinkSwitch-TNZ family of devices. This document describes the design procedure for buck and buck-boost converters.
AN-79 - Wave Soldering Guidelines for InSOP and HSOP Packages	Description This document offers guidelines for wave soldering design of InSOP-24 and HSOP-28 packages, particularly those without bottom exposed pads. Although IR/convection reflow is recommended for surface-mount attachment, both packages have been designed with wave soldering in mind when it is unavailable or not preferred. The document provides recommendations for solder pad layout, maximum spacing between solder pads, and solder thieves' orientation and design.
AN-75 - LYTSwitch-6 Family Design Guide	Description LYTSwitch-6 Family Design Guide
AN-70 - LinkSwitch-TN2 Design Guide	Description This document describes the design procedure for buck and buck-boost converters using the LinkSwitch-TN2 family of integrated off-line switchers.
AN-65 - LYTSwitch-5 Design Guide	Description
AN-60 - LYTSwitch-0 Design Guide	Description LYTSwitch-0 Design Guide
AN-59 - LYTSwitch-4 Design Guide	Description
AN-303 - Qspeed Family RoHS Compliant Soldering Considerations	Description Qspeed Family RoHS Compliant Soldering Considerations
AN-302 - Qspeed Reverse Voltage Sharing of Series Rectifiers	Description Reverse Voltage Sharing of Series Rectifiers
AN-301 - Qspeed Reverse Recovery Charge, Current and Time	Description Reverse Recovery Charge, Current and Time
AN-300 - Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing	Description Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing
AN-55 - HiperLCS Family Design Guide	Description HiperLCS Family Design Guide
AN-39 - LinkSwitch-LP Design Guide	Description LinkSwitch-LP Design Guide