Application Notes

標題	說明
AN-98 - LinkSwitch-TNZ Family Buck and Buck-Boost Design Guide	Description This application note provides information for designing a non-isolated power supply using the LinkSwitch-TNZ family of devices. This document describes the design procedure for buck and buck-boost converters.
AN-79 - Wave Soldering Guidelines for InSOP and HSOP Packages	Description This document offers guidelines for wave soldering design of InSOP-24 and HSOP-28 packages, particularly those without bottom exposed pads. Although IR/convection reflow is recommended for surface-mount attachment, both packages have been designed with wave soldering in mind when it is unavailable or not preferred. The document provides recommendations for solder pad layout, maximum spacing between solder pads, and solder thieves' orientation and design.
AN-75 - LYTSwitch-6 系列設計指南	Description LYTSwitch-6 系列設計指南
AN-70 - LinkSwitch-TN2 設計指南	Description
AN-65 - LYTSwitch-5 應用說明	Description
AN-60 - LYTSwitch-0 應用說明	Description LYTSwitch-0 應用說明
AN-59 - LYTSwitch-4 Design Guide	Description
AN-303 - Qspeed Family RoHS Compliant Soldering Considerations	Description Qspeed Family RoHS Compliant Soldering Considerations
AN-302 - Qspeed Reverse Voltage Sharing of Series Rectifiers	Description Reverse Voltage Sharing of Series Rectifiers
AN-301 - Qspeed Reverse Recovery Charge, Current and Time	Description Reverse Recovery Charge, Current and Time
AN-300 - Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing	Description Qspeed High Temperature Reverse Bias (HTRB) Reliability Testing
AN-55 - HiperLCS Family Design Guide	Description HiperLCS Family Design Guide
AN-39 - LinkSwitch-LP Design Guide	Description LinkSwitch-LP Design Guide